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詢問表單

DSP820

產品階段 : 即將推出

High-Density Edge AI Agent Swarm Server

產品規格表 (PDF)
產品規格表 (PDF)
立即詢價
立即詢價
DSP820
DSP820
DSP820
10G LAN

10G LAN

8K

8K

Hot-swapping

Hot-swapping

Modular Design

Modular Design

Redundant Power

Redundant Power

  • 產品特色
  • 產品規格
  • 訂購資訊
  • 技術文件
  • 常見問題

產品特色

  • Supports 16 hot-swappable Intel® SDM modules
  • Supports external 10GbE (up to 40GbE) network connectivity
  • Supports internal 10GbE or 5GbE networking for communication among up to 16 Intel® SDM modules
  • Enables distributed Multi-AI Agent processing with independent and fault-isolated computing nodes
  • Advanced media playback solution supporting 16 HDMI 8K60 outputs
  • Integrates a 4.3-inch touchscreen for centralized system monitoring and management
Distributed AI Computing
Distributed AI Computing

Up to 16 independent Intel® SDM computing nodes for distributed AI workloads

Integrated High-Speed Networking
Integrated High-Speed Networking

Built-in high-speed networking for coordinated multi-node computing

Centralized Management
Centralized Management

4.3-inch P-CAP touchscreen for system monitoring and management

 

Designed for Distributed Intelligence

The DSP820 brings computing, networking, and system management together in a high-density modular platform designed for distributed AI workloads. Supporting up to 16 Intel® SDM modules, it enables multiple independent computing nodes to operate within one coordinated infrastructure.

This integrated architecture simplifies deployment while providing the flexibility required for evolving AI applications.

 

From Multi-Device to One Platform

Conventional distributed edge deployments may require multiple computing systems, external switches, and separate management infrastructure. The DSP820 consolidates these elements into one integrated platform to reduce system complexity.

Its built-in high-speed networking connects up to 16 computing nodes, reducing external components while enabling coordinated communication among distributed workloads.

 
 

Built for Continuous Operation

Each DSP820 computing module operates independently. If one node requires maintenance, the affected module can be isolated while the remaining nodes continue operating.

Combined with hot-swappable Intel® SDM modules, this fault-isolated architecture helps minimize service disruption in multi-node deployments.

 

Engineered for Thermal Stability

A ventilated chassis and flexible cooling work together to support high-density computing.

01

Honeycomb Front Panel

A highly ventilated surface supports efficient heat dissipation.

02

Ventilated Chassis

Ventilation structures on both sides support system-level thermal circulation.

03

Module-Level Cooling

Cooling can be optimized for each Intel® SDM module.

DSP820 Thermal Stability

Smart Retail Applications

One coordinated computing platform for multiple AI workloads across smart retail environments.

01

Smart Shelf Monitoring

Monitor shelf activity and product availability.

02

AI Shopping Assistant

Support intelligent customer interaction and product recommendations.

03

Loss Prevention

Support AI-based monitoring for suspicious activities.

DSP820 Smart Retail Applications

Rich I/O Interfaces

DSP820 Front I/O

產品規格

SDM Module
  • SDM530L
CPU
  • Intel® Core™ Ultra 5 125H or Core™ Ultra 7 155H processors (Meteor Lake-H)
Chipset
  • SoC integrated
System Memory
  • Dual DDR5-5200 SO-DIMM, up to 96GB per SDM
BIOS
  • American Megatrends Inc. UEFI (Unified Extensible Firmware Interface)
TPM
  • dTPM2.0
Ethernet
  • 16 x 10GbE LAN (Intel® E610) (rear I/O)
  • 1 x 40GbE LAN (front I/O) supporting 10GbE intranet communication for 16 SDM modules
Display
  • 16 x HDMI output 2.1 (8K @ 60Hz)
USB
  • 32 x USB 3.2 Gen 2 Type-A
SDM I/O
  • 1 x HDMI 2.1
  • 1 x DisplayPort 1.4
  • 1 x USB 3.2 Gen 2 x1
  • 1 x 10GbE LAN
  • 1 x Serial TX/RX
  • 1 x I2C
  • 1 x PCIe x1
Storage
  • 1 x M.2 Key M 2230 slot (PCIe Gen 4 x4)/per SDM
  • 1 x M.2 Key M 2280 slot (PCIe Gen 4 x4 and SATA signals)/per SDM
Expansion
  • 1 x M.2 Key M 2280 slot/per SDM (PCIe Gen 4 x4 and SATA signals) for HDMI capture card
Power Input
  • Through SDM golden finger +12V and +3.3VSB or +12V DC-in through front I/O
Power Consumption (Max.)
  • 1 x 960W, redundant power supply
Watchdog Timer
  • 255 levels, 1 to 255 sec.
Operating Temperature
  • 0°C to +30°C (+32°F to +86°F)
Relative Humidity
  • 10% to 95% relative humidity, non-condensing
Construction
  • Steel chassis
Dimensions (W x D x H)
  • 480 x 223 x 325 mm (18.89" x 8.75" x 12.87")
Weight (net/gross)
  • 10 kg (22.04 lbs)/11 kg (24.25 lbs)
OS
  • Windows® 11 IoT LTSC, Linux

訂購資訊

  • DSP820-SDM530L-I5-125H
    DSP820 with SDM530L Intel® Core™ Ultra 5 processors (Meteor Lake-H) 125H, 16 LAN, 32 USB 3.2, and 16 HDMI 2.1
  • DSP820-SDM530L-I7-155H
    DSP820 with SDM530L Intel® Core™ Ultra 7 processors (Meteor Lake-H) 155H, 16 LAN, 32 USB 3.2, and 16 HDMI 2.1

技術文件

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常見問題FAQ